Manual Wire Bonders

7KF/ 7KFH Convertible Manual Wire Bonders, X-Y-Z, Wedge / Ball / Ribbon with 7" Capacitive Touch Screen

PROGRAMMING: The machine may be programmed for up to thirty devices per mode of operation in separate buffers. Each buffer may have up to 21 stitch bonds with individual ultrasonic power, time, force, and loop elevation control data. Program values, action prompts and fault diagnostics are displayed on a 7” LCD Capacitive Touch Screen.

FEATURES: Programmable force (15-120 grams), primary and secondary ball sizes, pure vertical Z, orthogonal X, Y, Z, 8:1 micromanipulator, pneumatic braking of all axes during bonding and programmable radiant tool heat. The system is available without the base and work platform as a 7KFX for tabletop or conveyor system. Risers are also available for extra tall parts.

Wire Bonder

7KE / 7KEH Convertible Manual Wire Bonder, X-Y-Z, Wedge / Ball / Ribbon

UNLIMITED PART SIZE: Access to remote bond targets on large packages or modules with WEST•BOND’s throat-less chassis and micromanipulator design. All machines components are arrayed above the horizontal bond plane, eliminating any restriction to package size or shape. With the EX version of this system, the bonder can be suspended over very large parts. This manual model can be configured to bond all types of applications from  Microwave – Semiconductor to – RF and – Hybrid production.

CONVERTABILITY: WEST•BOND introduced the first triple convertible wire bonder back in November of 1969, today WEST•BOND introduces a new tool head that can bond it all: 45° wedge, 90° feed for wire and ribbon as well as ball bonding. A simple exchange of clamp assemblies, bond tool, and wire path provided with the software mode will allow conventional 45° wire feed, deep access wire or ribbon, ball bonding, insulated wire and single point tab / lead bonding. All programmed bond variables as well as machine settings for each bond mode are retained in the machines memory.

7476E / 747630E Wedge-Wedge Wire Bonders

PROGRAMMING for thirty different device types may be entered into separate buffers. Each device wire may have up to 21 stitch bonds with individual ultrasonic power, time, force (high or low) and loop elevation control data. Program values, action prompts, and fault diagnostics are exhibited on the easy to read 4 line, 40 character LCD sequentially with machine operation.

FEATURES include programmable dual force (high or low), pure vertical Z, pneumatic braking of all axes during bonding, and radiant tool heat. Available with or without the base and work platform for tabletop or conveyor system applications.

UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual “E” Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.

CONVERTIBILITY for a variety of bonding methods is pioneered by West·Bond. A simple exchange of wire clamp assemblies, provided with specified models, allows conventional 45o wire feed, deep access 90o wire or ribbon feed, and single point tab/lead bonding. All programmed bond variables and machine settings for each tool head are retained in memory and retrieved automatically upon conversion.

7440E Ultrasonic Insulated Wire Bonder

The machines of West·Bond’s Model 7440E Series are dedicated ultrasonic wire bonders for interconnecting insulated, gold plated, copper wire to thin film sliders or Flex-Circuits of Computer Disk Drives, or for other similar insulated wire connection applications.

These machines bond insulated wires of 0.0007 to 0.002 inch diameter directly to thin film gold without the need to first strip off the insulation. This is accomplished by a specially designed wedge tool applied with programmed ultrasonic energy, force, and time, to soften and disperse insulation, then to bond the exposed wire to the work piece metallization. West·Bond’s unique single lever X-Y-Z micromanipulator makes it possible to use this process for bonding disk sliders by enabling the operator to engage a free standing end of a twisted wire pair in mid air and direct that end to touch down on the work piece at the bond target, all under microscope observation. Touchdown is sensed by the machine to initiate the bond program.

Embodied in this series is a new and unique West·Bond three-axis micromanipulator in which the entire mechanism is arrayed above the work plane, so that there is now no limit to the size of a work piece. Each of the X, Y, and Z axes is straight-line and purely orthogonal, and each can be braked pneumatically on signal. In this application, all axes are braked during the ultrasonic bond time to aid operator control.

7440D Ultrasonic Insulated Wire Bonder

The machines of West·Bond’s Model 7440D Series are dedicated ultrasonic wire bonders for interconnecting insulated, gold plated, copper wire to thin film sliders or Flex-Circuits of Computer Disk Drives, or for other similar insulated wire connection applications.

These machines bonds insulated wires of 0.7 to 2.0 mils diameter directly to thin film gold without the need to first strip off the insulation. This is accomplished by a specially designed wedge tool applied with programmed ultrasonic energy, force, and time, to soften and disperse insulation, then to bond the exposed wire to the work piece metallization. West·Bond’s unique single lever X-Y-Z micromanipulator makes it possible to use this process for bonding disk sliders by enabling the operator to engage a free standing end of a twisted pair wire in mid air and direct that end to touch down on the work piece at the bond target, all under microscope observation. The machine senses touchdown to initiate the bond program.

It is the first series of the West·Bond line to embody the new three axis mechanical advantage manipulator which is independently guided along each axis, and so is able to transmit motion and force from control to tool undisturbed by loading forces from any other direction. For operation in a horizontal plane, the pantograph mechanism is counterbalanced by weight, and the tool assembly is counterbalanced by an adjustable spring.

7476D Wedge-Wedge Wire Bonder

CONVENTIONAL 45 degree wire feed and unique clamp design of West·Bond’s Model 7476D Series wedge-wedge wire bonders provide the precision and control for the smallest, most accurate loop formations. Consistent and repeatable profiles are easily achieved with the patented single lever X-Y-Z micromanipulator and optical Z encoder.

CONVERTIBILITY for a variety of bonding methods is pioneered by West·Bond. A simple exchange of wire clamp assemblies, provided with specified models, allows conventional 45o wire feed, deep access 90o wires or ribbon feed, and single point tab/lead bonding. All programmed bond variables and machine settings for each tool head are retained in memory and retrieved automatically upon conversion.

PROGRAMMING for three different device types may be entered into separate buffers. Each device wire may have up to 21 stitch bonds with individual ultrasonic power, time, force (high or low) and loop elevation control data. Program values, action prompts, and fault diagnostics are exhibited on the easy to read 4 line, 40 character LCD sequentially with machine operation.

7700D Ball-Wedge Wire Bonder

BALL-WEDGE BONDING Machines of this series bond gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the ball-to-wedge technique using ultrasonic energy and work piece heat. Wire is clamped and threaded vertically through a hollow capillary, allowing independent feeding action. The connection is begun with a ball formed on the end of the wire stock by electric discharge, and completed by a wedge bond under the end of the capillary tool. The operator using hand/eye reference to bond targets and elevations guides the bonding tool manually.

DEEP ACCESS to bond targets recessed within high walled packages is gained with West·Bond’s model 7700D ball-wedge wire bonder. The 90o wire feed and overhead clamp design allows the closest proximity to adjacent walls or components. The system also allows for bonding in any direction from the initial ball bond without the need to rotate the work piece.

THROAT REACH is 5.125-in. from tool home position back to the machine lower panel. Vertical clearance above the work plane is approximately 0.250-in. over the throat reach distance. Range of movement of the tool by manipulator control is 0.563-in. vertically and 0.625-in. in horizontal directions with an 8/1 ratio of mechanical advantage.