UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.
CONVERTIBLE model 7372E includes interchangeable tool head assemblies for bonding by either epoxy (near right) or eutectic (far right) methods. Pick-up tool rotation and radiant heat are standard. All programmed bond variables for each tool head assembly are retained in memory, and are retrieved upon conversion.