Manual Die Bonders

7374E Beam Lead Bonder

UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.

MODEL 7374E adapted for ultrasonic bonding, with heat of the tab leads of beam lead diodes. The right head, the same as the machines above, is used for pick up of the tabbed die with provision for rotation at placement. The left head (see right) is equipped with K~Sine 46E Ultrasonic transducer and with radiant heat to the bond tool.

7372E Epoxy & Eutectic Die Bonder

UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.

CONVERTIBLE model 7372E includes interchangeable tool head assemblies for bonding by either epoxy (near right) or eutectic (far right) methods. Pick-up tool rotation and radiant heat are standard. All programmed bond variables for each tool head assembly are retained in memory, and are retrieved upon conversion.

7367E Eutectic Tweezer Die Bonder

UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.

MODEL 7367E combines mechanized tweezers for pick-up, placement, and scrubbing of die, with a rotatable vacuum capillary for pick-up and placement of pre-forms. Tweezing is activated pneumatically with the clamping force adjustable to the very low values necessary to pick up and place fragile die that could be damaged by other handling means.

7200CR Dual Head Epoxy Die Bonder

The fully programmable Microprocessor Controlled dispensing of epoxy ensures precise dot size. The EPOXY DISPENSE HEAD contains a 1cc reservoir for Epoxy. A variety of dispense needles are available to suit most applications. Dispense elevation is programmable. Following the dispense sequence; the machine automatically calls for the VACUUM PICKUP TOOL when the tool head assembly is lifted to a programmed elevation from the work. The Machine can be programmed for operator input to toggle between the EPOXY DISPENSE TOOL and the VACUUM PICKUP TOOL for pick and place operation.

The VACUUM PICKUP TOOL has a flat-faced Delrin tip with a vacuum through hole. A broad range of die sizes can be handled with a single tool. Die selected from practically any carrier media can be manipulated and rotated (360o) into position. Vacuum can be turned On or Off either by contact with the die surface or by control of the operator at any elevation.

7316C Single Head Eutectic Die Bonder

WEST·BOND’s 7300C Series pick up and place chips for manual die attachment by mechanical or ultrasonic scrub, eutectic method. All operation is controlled by West·Bond’s unique three-axis micromanipulator under microprocessor control. The work piece is held on a heated work holder, where chips are also arrayed for pick up.

MODEL 7300C, 7316C Offers one collet for vacuum die pickup, placement, and ultrasonic or mechanical scrub. The ultrasonic power and time, or length, number of cycles, direction, and velocity of scrub strokes are microprocessor controlled for precision and repeatable die placement, and are easily programmed at the machine panel, depending on the selected model. Radiant tool heat with temperature control is standard.

7201CR Triple Head Epoxy Die Bonder

The fully programmable Microprocessor Controlled dispensing of epoxy ensures precise dot size. Each EPOXY DISPENSE HEAD contains 2 5/8cc reservoirs for Epoxy. A variety of dispense needles are available to suit most applications. Dispense elevation is programmable. Following the dispense sequence; the machine automatically calls for the VACUUM PICKUP TOOL when the tool head assembly is lifted to a programmed elevation from the work. The Machine can be programmed for operator input to toggle between the EPOXY DISPENSE TOOL and the VACUUM PICKUP TOOL for pick and place operation.

The VACUUM PICKUP TOOL has a flat-faced Delrin tip with a vacuum through hole. A broad range of die sizes can be handled with a single tool. Die selected from practically any carrier media can be manipulated and rotated (360o) into position. Vacuum can be turned On or Off either by contact with the die surface or by control of the operator at any elevation.

7327C Single Head Eutectic Die Bonder

MODEL 7327C offers up to 6 different die collets on a pneumatically operated turret mechanism for complex packages with a variety of die sizes. Desired collets are advanced into position by operator activated push button switch on micromanipulator ball. Six sets of values for length, number of cycles, direction, and velocity of scrub strokes are entered into buffers associated with the turret tool positions, as to execute a scrub motion program appropriate to each die collet tool. Radiant tool heat is not available with the 7327C.