UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Manual “E”Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.
MODEL 7374E adapted for ultrasonic bonding, with heat of the tab leads of beam lead diodes. The right head, the same as the machines above, is used for pick up of the tabbed die with provision for rotation at placement. The left head (see right) is equipped with K~Sine 46E Ultrasonic transducer and with radiant heat to the bond tool.