New Series Die Bonder

This series is an excellent tool for meeting the challenging die bonding applications found in the RF, microwave, semiconductor, hybrid and medical device fields.

New Series Wire Bonder

This series is an excellent tool for meeting the challenging die bonding applications found in the RF, microwave, semiconductor, hybrid and medical device fields.

Industries that use our Products

Semi-Automatic Wire Bonders

Manual Die Bonders

Manual Wire Bonders

Product Sub-Assemblies

Pull Test Machines

News & Events

2023 New Series Die Bonder- 73KF

Press Release- June 2022 New Series Wire Bonder

SEMICON Tokyo 2022

Put our Products to Work!

About WEST•BOND

Since 1966, WEST•BOND has designed and manufactured a renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry.