AUTOMATIC PRECISION at a fraction of the cost. Microprocessor controlled motors drive both the Y and Z axes for a series of parallel, single or multiple arched wires maintaining identical loop and bond shapes. This system is ideal for bonding high power, high frequency devices where identical bond and loop shapes are critical. In such applications as Microwave – Semiconductor – RF and Hybrid products.
UNLIMITED PART SIZE: Access to remote bond targets on large packages or modules with WEST·BOND’s throat-less chassis and micromanipulator design. All machines components are arrayed above the horizontal bond plane, eliminating any restriction to package size or shape. The EX version of this system the bonder can be suspended over very large parts.
CONVERTABILITY: WEST·BOND introduced the first triple convertible wire bonder back in November of 1969, today WEST·BOND introduces a new tool head that can bond it all: 45° wedge, 90° feed for wire and ribbon as well as ball bonding.