UNLIMITED DEEP REACH access to remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry, and enclosures are arrayed above the horizontal work area, eliminating any restrictions to package size or shape. Manual “E” Series models are available for all microwave, semiconductor, R.F., and hybrid production, and are ideal for repair station or laboratory use.
EXCEPTIONALLY convenient means of testing the tensile strength of fine wire bonds. Reach wires in any quadrant on packages of unlimited size with a rotatable micro- hook, and test in either destruct or non-destruct modes with motorized, microprocessor controlled precision through a range of 100 grams.