Wire Bonding Book

Wire bonding is not a simple matter, especially when new materials, techniques, and parameters are being used every day. Vital to a successful wire-bonding program is an in-depth knowledge of how all of these components work together to make quality bonds. This book can help a process engineer develop and refine individual wire bonding processes. A must have for anyone involved in process development.

Wire Bonding in Microelectronics Materials, Processes, Reliability, and Yield

Author: George Harman
ISBN: 0-07-032619-3
Price: $65.00 U.S.A.
Publisher Details: McGraw-Hill, June 1, 1997. Copyright: 1998. Hardcover, 290 pages.


The definitive single-volume reference on wire bonding just got better – in an extensively updated edition with over 100 new pages on new materials, new interconnect techniques such as fine pitch wire bonding, and evaluating the pros and cons of alternative bonding technologies.

Wire bonds are used to interconnect integrated circuits, multichip modules and hybrids, and microwave as well as power devices to their packages. The book explains it all, with special emphasis on fine pitch bonding, bonding to MCM’s, and additional areas that have been developed since the first edition was published.


The wire-bonding bible – now revised and expanded! Get the practical know-how you need to design and evaluate wire bonds engineered with the latest – and still-evolving- metallurgies. Extensively revised and updated, the Second Edition of George Harman’s classic Wire Bonding in Microelectronics shows you step-by-step how to exploit new higher density interconnection techniques and engineer reliable bonds at a very high yield. You get the hands-on guidance you need to test wire bonds…clean bond pads to improve bondability and reliability…solve cratering, heel cracks, bond fatigue, so-called purple plague and other mechanical problems…. bond wires to multichip modules… and much, much more. You also get up-to-the-minute details on utilizing fine pitch SMT, applying new bonding metallurgies, and exploring wire sweep and the wire bonding mechanism.